www.roith ner - laser.com 1 uv lux 305 - 3 ? deep ultraviolet light emission source ? 3 1 0 nm, 1 - 3 mw ? 4 chip led array ? uv - curing, phototherapy maximum rating (t case = 25c) parameter symbol values unit min. max. power dissipation, dc * p d 600 mw forward current (t a =25c) i f 80 ma operating temperature t opr - 30 + 5 5 c storage temperature t stg - 3 0 + 100 c soldering temperature t sol + 190 c * maximum dissipated power must not exceed 200mw without thermal management electro - optical characteristics (t case = 25c, i f = 80 ma) parameter symbol values unit min. typ. max. peak wavelength *1 p 305 3 1 0 3 15 nm spectral width (fwhm) ? 12 15 nm forward voltage *2 v f 5.5 7.5 v radiated power *3 p o 1 3 mw beam angle (hemispherical lens) 2? 1/2 20 deg. beam angle (flat window) 2 ? 1/2 120 deg. * 1 wavelength measurement tolerance: 2 nm * 2 forward voltage measurement tolerance: 2 % * 3 output power measurement tolerance: 10 % electrical connection pin # function pin 1 anode pin 2 cathode pin 3 case d escription uv lux 305-3 is a series of algan based deep uv multi chip led arrays, utilizing 4 parallel connected chip dies, with a typical peak wavelength of 3 10 nm and optical output power of 1 - 3 mw . it comes in hermetically sealed to39 metal can package with hemispherical lens or flat glass window . uv lux 305- 3 is widely used for uv - curing, phototherapy, optical sensing and ima ging applications. v2 07/ 14 bottom view: elec t rical l ayout:
www.roithner - laser.com 2 outline dimensions fw - flat window all dimensions in mm hl - hemispherical lens all dimensions in mm device materials part material header fe - ni alloy, plated ni - au leads fe - ni alloy, plated ni - au bonding wires au lens sio 2
www.roithner - laser.com 3 emission characteristics fw - flat window hl - hemispherical lens
www.roithner - laser.com 4 precautions soldering: ? do avoid overheating of the led ? do avoid electrostatic discharge (esd) ? do avoid mechanical stress, shock, and vibration ? do only use non - corrosive flux. ? do only solder the leads. soldering of header or cap will damage the led ? do only cut the leads at room temperature with an esd protected tool ? do not solder closer than 3 mm from base of the header ? do form leads prior to soldering ? do not impose mechanical stress on the header when forming the leads ? do not apply current to the led until it has cooled down to room temperature after soldering recommended soldering conditions: dip soldering hand soldering pre - heat time max 30 s soldering time max 5 s dipping time max 5 s solder bath temperature max 190 c solder temperature max 190 c it is strongly advised to perform soldering at the shortest time and lowest temperature possible. cleaning : cleaning with isopropyl alcohol, propanol, or ethyl alcohol is recommended do not use acetone, chloroseen, trichloroethylene, or mks do not use ultrasonic cleaners static electricity: uvtop are sensitive to electrostatic discharge (esd) . precautions against esd must be taken when handling or operating these leds. surg e voltage or electrostatic discharge can result in complete failure of the device. uv - radiation: during operation these leds do emit high intensity ultraviolet light , which is hazardous to skin and eyes , and may cause cancer. do avoid exposure to the emitted uv light. protective glasses are recommended . it is further advised to attach a warning label on products/systems that do utilize uv - leds: operation: do only operate uvtop leds with a current source. running these leds from a voltage source will result in complete failure of the device. current of a led is an exponential function of the voltage across it. usage of current regulated drive circuits is mandatory ? all rights reserved the above specifications are for reference purpose only and subjected to change without prior notice class 1
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